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 INTEGRATED CIRCUITS
DATA SHEET
TDA9845 TV and VTR stereo/dual sound processor with digital identification
Preliminary specification Supersedes data of January 1993 File under Integrated Circuits, IC02 1995 Mar 20
Philips Semiconductors
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
FEATURES * Supply voltage 5 to 8 V * Source selector * Stereo matrix * AF input for mono source * AF outputs for Main * LED operation mode indication (stereo and dual) * High identification reliability. QUICK REFERENCE DATA SYMBOL VP IP Vi(rms) PARAMETER supply voltage (pin 18) supply current (pin 18) nominal input signal voltage (Vi 1, Vi 2, Vi 3) (RMS value) nominal output signal voltage (RMS value) clipping level of the output signal voltages (RMS value) without LED current 54% modulation B/G L (only for Vi 1) Vo(rms) Vo(rms) 54% modulation THD 1.5% VP = 5 V VP = 8 V ILON Vi pil S/N(W) THD Tamb fident tident ON Vi tuner fpil input current input voltage sensitivity of pilot frequency weighted signal-to-noise ratio total harmonic distortion operating ambient temperature range identification window width total identification time ON identification voltage sensitivity pull-in frequency range of pilot PLL f = 10.008 MHz lower side upper side ORDERING INFORMATION TYPE NUMBER TDA9845 TDA9845T PACKAGE NAME DIP20 SO20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm -296 302 - - STEREO DUAL LED ON unmodulated 1.4 2.4 - 5 66 - 0 2.2 2.3 0.35 - 1.6 2.65 - - 75 0.2 - - - - 28 - - - - - 250 500 500 - - - CONDITIONS MIN. 4.5 12 TYP. 5 13 GENERAL DESCRIPTION
TDA9845
The TDA9845 is a stereo/dual sound processor for TV and VTR sets. Its identification ensures safe operation by using internal digital PLL technique with extremely small bandwidth, synchronous detection and digital integration (switching time maximum 2.1 s; identification concerning the main functions).
MAX. 8.8 16.5 V
UNIT mA mV mV mV
V V mA mV dB % C Hz Hz s dBV Hz Hz
12 100 - 0.3 +70 2.2 2.3 2.1 - -296 302
"CCIR468-3"
VERSION SOT146-1 SOT163-1
1995 Mar 20
2
full pagewidth
Vi 3 250 mV RMS CD2 + 2.2 F 50 k 10 6 dB -6 dB AM 250 mV RMS MAIN 6 dB
stereo transmission
1995 Mar 20
CD1 10 nF 10 nF AM 3 dB 500 mV RMS 0 dB 5 k 12 Vo 1 17 13 A/MONO L 10 k 10 k L/A/MONO 250 mV RMS 500 mV RMS 11 Vo 2 15 0 dB 5 k 14 R/B 250 mV RMS mute
dual transmission
2.2 k
2.2 F
+
BLOCK DIAGRAMS
Vi 1
8
-3 dB
Philips Semiconductors
L+R , A 2
2.2 k
15 k
-6 dB
250 mV RMS (AM: 500 mV RMS)
35 k
35 k
2.2 F
15 k
Vi 2
9
+
LEDST 1 k VP LEDDU
R, B
250 mV RMS DUAL bit DIGITAL PLL AND DEMODULATOR DIGITAL INTEGRATOR 274 Hz CONTROL LOGIC DIGITAL PLL DIGITAL INTEGRATOR 25 k DIGITAL PLL AND DEMODULATOR 117 Hz STEREO bit 1 2 20
TDA9845
30 k
47 pF
C1 C2 C3
TV and VTR stereo/dual sound processor with digital identification
3
25 k OSCILLATOR Vref SUPPLY POWER-ON RESET 19 1/2 V P 10 MHz Cref + 100 F/ 16 V XTAL C ref VP GND 7 18 16
V i pil
6
3.3 nF
2.5 mH
CDCL
5
100 nF
+
CAGC
3
10 F
CLP
4
10 nF
MED644 - 1
Input and output levels are nominal values. They are related to the SCART norm. (AM: m = 0.54, FM: f = 27 kHz).
Preliminary specification
TDA9845
Fig.1 Block diagram of the bipolar TV/VTR-stereo decoder.
Vi 3 250 mV RMS CD1 10 nF 10 nF 13 17 5 k 6 dB -6 dB AM 250 mV RMS MAIN 6 dB
stereo transmission
book, full pagewidth
CD2 + 2.2 F 50 k 10 500 mV RMS 12 Vo 1 L/A/MONO 250 mV RMS 500 mV RMS 11 Vo 2 15 0 dB 5 k 14 mute
dual transmission
1995 Mar 20
AM 3 dB 0 dB A/MONO L 10 k 10 k R/B 250 mV RMS LEDST 1 k VP LEDDU
2.2 k
2.2 F
+
Vi 1
8
-3 dB
Philips Semiconductors
L+R , A 2
2.2 k
15 k
-6 dB
250 mV RMS (AM: 500 mV RMS)
35 k
35 k
2.2 F
15 k
Vi 2
9
+
R, B
250 mV RMS DUAL bit DIGITAL PLL AND DEMODULATOR DIGITAL INTEGRATOR 274 Hz CONTROL LOGIC DIGITAL PLL DIGITAL INTEGRATOR 25 k DIGITAL PLL AND DEMODULATOR 117 Hz STEREO bit 1 2 20
TDA9845
27 k
180 pF
C1 C2 C3
TV and VTR stereo/dual sound processor with digital identification
4
25 k OSCILLATOR Vref SUPPLY POWER-ON RESET 19 1/2 VP 10 MHz + 100 F / 16 V XTAL C ref VP GND 7 18 16
V i pil
6
18 nF 2%
4.7 mH 5%
C DCL
5
100 nF
+
CAGC
3
10 F
CLP
4
10 nF
MED645 - 1
Input and output levels are nominal values. They are related to the SCART norm. (AM: m = 0.54, FM: f = 27 kHz).
The components of the external LC band-pass filter have the following order-No.: Philips Germany only No: 431202017525 or Fastron Sdn. Bha., Malaysia type SMCC 472 J for L = 4.7 MHz (5%) Philips Components No: 2222 429 71802, C = 1.8 nF (2%).
Preliminary specification
TDA9845
Fig.2 Block diagram of the bipolar TV/VTR-stereo decoder with fixed coil (alignment-free).
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
PINNING SYMBOL C1 C2 CAGC CLP CDCL Vi pil Cref Vi 1 Vi 2 Vi 3 Vo 2 Vo 1 CD1 LEDDU LEDST GND CD2 VP XTAL C3 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION control input Port C1 control input Port C2 AGC capacitor of pilot frequency amplifier identification low-pass capacitor DC loop capacitor pilot frequency input voltage capacitor of reference voltage (12VP) AF input signal voltage 1 (from sound carrier 1 or AM sound (standard L) AF input signal voltage 2 (from sound carrier 2) AF input signal voltage 3 (Mono sound) AF output signal voltage 2 (Main) AF output signal voltage 1 (Main) 50 s de-emphasis capacitor of AF Channel 1 LED (dual) LED (stereo) ground (0 V) 50 s de-emphasis capacitor of AF Channel 2 supply voltage (+5 to +8 V) 10 MHz crystal input control input Port C3
lfpage
TDA9845
C1 C2 CAGC CLP CDCL V i pil Cref Vi 1 Vi 2
1 2 3 4 5
20 C3 19 XTAL 18 V P 17 CD2 16 GND
TDA9845
6 7 8 9 15 LEDST 14 LEDDU 13 CD1 12 Vo 1 11 Vo 2
MED646
Vi 3 10
Fig.3 Pin configuration.
1995 Mar 20
5
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
FUNCTIONAL DESCRIPTION AF signal handling The input AF signals, derived from the two sound carriers, are processed in analog form using operational amplifiers. Dematrixing uses the technique of two amplifiers processing the AF signals. Finally, a source selector provides the facility to route the mono signal through to the outputs (`forced mono'). De-emphasis is performed by two RC low-pass filter networks with internal resistors and external capacitors. This provides a frequency response with the tolerances given in Fig.4. A source selector, controlled via the control input ports allows selection of the different modes of operation in accordance with the transmitted signal. The device was designed for a nominal input signal (FM: 54% modulation is equivalent to f = 27 kHz) of 250 mV RMS (Vi 1, Vi 2) and for a nominal input signal (AM: m = 0.54) of 500 mV RMS (Vi 1), respectively 250 mV RMS (Vi 3). A nominal gain of 6 dB for Vi 1 and Vi 2 signals (0 dB for Vi 1 signal (AM sound)) and 6 dB for Vi 3 signal is built-in. By using rail-to-rail operational amplifiers, the clipping level (THD 1.5%) is 1.60 V RMS for VP = 5 V and 2.65 V RMS for VP = 8 V at outputs Vo 1, Vo 2. Care has been taken to minimize switching plops. Also total harmonic distortion and random noise are considerably reduced. Identification The pilot signal is fed via an external RC high-pass filter and single tuned LC band-pass filter to the input of a gain controlled amplifier. The external LC band-pass filter in combination with the external RC high-pass filter should have a loaded Q-factor of approximately 40 to 50 to ensure the highest identification sensitivity. By using a fixed coil (5%) to save the alignment (see Fig.2), a Q-factor of approximately 12 is proposed. This may cause a loss in sensitivity of approximately 2 to 3 dB. A digital PLL circuit generates a reference carrier, which is synchronized with the pilot carrier. This reference carrier and the gain controlled pilot signal are fed to the AM-synchronous demodulator. The demodulator detects the identification signal, which is fed through a low-pass filter with external capacitor CLP (pin 4) to a Schmitt-trigger for pulse shaping and suppression of low level spurious signal components. This is a measure against mis-identification. Control input ports
TDA9845
The identification signal is amplified and fed through an AGC low-pass filter with external capacitor CAGC (pin 3) to obtain the AGC voltage for controlling the gain of the pilot signal amplifier. The identification stages consist of two digital PLL circuits with digital synchronous demodulation and digital integrators to generate the stereo or dual sound identification bits which can be indicated via LEDs. A 10 MHz crystal oscillator provides the reference clock frequency. The corresponding detection bandwidth is larger than 50 Hz for the pilot carrier signal, so that fp-variations from the transmitter can be tracked in the event of missing synchronization with the horizontal frequency fH. However the detection bandwidth for the identification signal is made small (1 Hz) to reduce mis-identification. Figure 2 shows an example of the alignment-free fp band-pass filter. To achieve the required QL of around 12, the Q0 at fp of the coil was chosen to be around 25 (effective Q0 including PCB influence). Using coils with other Q0, the RC-network (RFP, CFP) has to be adapted accordingly. It is assumed that the loss factor tan of the resonance capacitor is 0.01 at fp. Copper areas under the coil might influence the loaded Q and have to be taken into account. Care has also to be taken in environments with strong magnetic fields when using coils without magnetic shielding.
The complete IC is controlled by the three control input ports C1, C2 and C3 (TTL-level). With these ports the user can select between different AF sources according to the transmitter status (see Table 1). Finally Schmitt-triggers are added in the input port interfaces to suppress spikes from the control lines C1, C2 and C3. After a power-on reset, the logic is reset (mute mode for the AF channel). After some time (1 ms), when the power-on reset is automatically deactivated, the switch position of the Main channel is changed according to the control input port levels C1, C2 and C3. For standard L, the AM sound is fed via the AF input (Vi 1) to the two AF outputs (Vo 1,Vo 2). This can also be achieved by feeding at AF input Vi 3. The logic level combination 111 of the control input ports (C3, C2 and C1) is not allowed (see Table 1).
1995 Mar 20
6
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
Power supply The different supply voltages and currents required for the analog and digital circuits are derived from an internal band-gap reference circuit. The AF reference voltage is 1 V . For a fast setting to 1 V an internal start-up circuit 2P 2P is added. A good ripple rejection is achieved with the external capacitor Cref = 100 F/16 V in conjunction with the high ohmic input of the 12VP pin (pin 7). No additional DC load on this pin is allowed. Power-on reset When a power-on reset is activated by switching on the supply voltage or because of a supply voltage breakdown, the 117/274 Hz DPLL, the 117/274 Hz integrator and the logic will be reset. The AF channel (Main) is muted (1 ms). LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Vi Vi Vi Tstg Tamb Vesd Note 1. Charge device model class A: discharging a 200 pF capacitor through a series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-a DIP20 SO20 PARAMETER thermal resistance from junction to ambient in free air 73 90 VALUE PARAMETER supply voltage (pin 18) voltage at pins 1, 2 and 20 voltage at pins 3 to 13, 17 and 19 voltage at pins 14 and 15 storage temperature operating ambient temperature electrostatic handling for all pins note 1 CONDITIONS MIN. -0.3 -0.3 -0.3 -0.3 -25 0 -500 ESD protection
TDA9845
All pins are ESD protected. The protection circuits represent the latest state of the art. Internal circuit The internal pin loading diagram is given in Fig.7.
MAX. 10 9.0 VP 10 +150 +70 +500 V V V V C C V
UNIT
UNIT K/W K/W
1995 Mar 20
7
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
TDA9845
CHARACTERISTICS VP = 5 V; Tamb = +25 C; nominal input signal Vi 1, 2 = 0.25 V RMS value (FM: 54% modulation is equivalent to f = 27 kHz); nominal input signal Vi 1 = 0.5 V RMS value (AM: m = 0.54); nominal input signal Vi 3 = 0.25 V RMS value (AM: m = 0.54); nominal output signal Vo 1, 2 = 0.5 V RMS value; fAF = 1 kHz; Vi pil = 16 mV RMS value; fpil = 54.6875 kHz (identification frequencies: stereo = 117.48 Hz, dual = 274.12 Hz), 50 s pre-emphasis; noise measurement in accordance with "CCIR468-3", working oscillator frequency f = 10008 MHz; currents into the IC positive; measured in test circuit Fig.5 unless otherwise specified. SYMBOL Supply VP IP Ptot Vn(DC) Vref(DC) lL(DC) supply voltage (pin 18) supply current (pin 18) total power dissipation DC voltage (pins 8 to 13 and 17) DC reference voltage (pin 7) DC leakage current (pin 7) without LED current 4.5 12 54
1 V 2P 1 V 2P
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
5 13 65 - 0.1 - 0.1
1 V 2P 1 V 2P
8.8 16.5 145.2
1 1 2VP 2VP
V mA mW V V A + 0.1 + 0.1
-
-
1
AF Inputs; Vi 1 and Vi 2 (pins 8 and 9) Vi(rms) nominal input signal voltage (RMS value) 54% modulation B/G L (only Vi 1) Vi(rms) clipping voltage level (RMS value) THD 1.5% VP = 5 V; B/G VP = 8 V; B/G VP = 5 V; L (only Vi 1) VP = 8 V; L (only Vi 1) Gv AF signal voltage gain G = Vo/Vi; note 1 B/G L (only Vi 1) Ri Rdeem input resistance internal de-emphasis resistor see Fig.4 (pins 13 and 17) 5 -1 40 4.25 6 0 50 5.0 7 +1 60 5.75 dB dB k k 0.625 1.050 1.200 2.100 0.715 1.200 1.600 2.356 - - - - V V V V - - 0.25 0.5 - - V V
Additional AF input pin (pin 10) Vi(rms) Vi(rms) nominal input signal voltage (RMS value) clipping voltage level (RMS value) 54% modulation THD 1.5% VP = 5 V VP = 8 V Gv Ri AF signal voltage gain input resistance G = Vo/Vi; note 1 0.625 1.050 5 40 0.715 1.200 6 50 7 60 - V V dB k - 0.25 - V
1995 Mar 20
8
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
SYMBOL PARAMETER CONDITIONS - MIN. TYP. -
TDA9845
MAX.
UNIT
AF outputs (pins 11 and 12) Vo(rms) Vo(rms) nominal output signal voltage THD 0.3%; (RMS value) 54% modulation clipping voltage level (RMS value) THD 1.5% VP = 5 V VP = 8 V Ro CL RL B B-3 dB THD S/N(W) cr output resistance load capacitor on output load resistor on output (AC-coupled) frequency response (bandwidth) frequency response total harmonic distortion weighted signal-to-noise ratio crosstalk attenuation for DUAL STEREO mute VDC mute attenuation change of DC level output voltage between any two modes of operation DC output current fi = 40 to 20000 Hz; note 2 -3 dB; note 2 note 1 1.4 2.4 150 - 10 -0.5 300 - 66 1.6 2.65 250 - - - 350 0.2 75 - - 350 1.5 - +0.5 400 0.3 - V V nF k dB kHz % dB 0.5 V
"CCIR468-3" (quasi-peak)
notes 1 and 3 Zs 1 k Zs 1 k Zs 1 k; note 1 after switching
70 40 76 -
75 45 80 -
- - - 10
dB dB dB mV
PSRR IO(DC) fr f
power supply ripple rejection fr = 70 Hz; see Fig.6
50 -
65 -
- 20
dB A
10 MHz crystal oscillator (pin 19) series resonant frequency of crystal (fundamental mode) working oscillator frequency (running in parallel resonance mode) equivalent crystal series resistance CL = 20 pF over operating temperature range including ageing and influence of drive circuit even at extremely low drive level (<1 pW) over operating temperature range with C0 = 6 pF 9.995 9.988 10.008 10.008 10.021 10.028 MHz MHz
Rr
-
60
200
Rn C0 C1 PXTAL VOSC(p-p)
crystal series resistance of unwanted mode crystal parallel capacitance crystal motional capacitance level of drive in operation oscillator operating voltage (peak-to-peak value) with Rr 100
2 x Rr - - - 500
- 6 25 - 550
- 10 50 5 600
pF fF W mV
1995 Mar 20
9
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
SYMBOL Pilot processing Vi pil(rms) Ri pil Ci pil m fpil pilot input voltage level at pin 6 (RMS value) pilot input resistance pilot input capacitance modulation depth pilot PLL pull-in frequency range (referenced to fpil = 54.6875 kHz) AM f = 9.988 MHz lower side upper side f = 10.008 MHz lower side upper side f = 10.028 MHz lower side upper side tpil fLP R4 V4(rms) QL pilot PLL pull-in time low-pass frequency response low-pass output resistance identification threshold voltage (RMS value) loaded quality factor of resonance circuit loaded quality factor of resonance circuit with fixed coil tacqui AGC AGC acquisition time HIGH sensitivity; see Fig.1 sensitivity loss 2 to 3 dB; see Fig.2 Vi pil(rms) switched from 0 to 100 mV RMS value -3 dB -188 411 0 450 18.75 - 40 - - - - 600 25 - - 12 -188 411 1.7 750 -296 302 - - -296 302 -405 192 - - -405 192 unmodulated 5 500 - 25 - 1000 - 50 100 - 3 75 PARAMETER CONDITIONS MIN. TYP.
TDA9845
MAX.
UNIT
mV k pF % Hz Hz Hz Hz Hz Hz ms Hz k mV
31.25 70 50 -
-
-
0.1
s
Identification (internal functions) Vi tuner C/N H fdet identification voltage sensitivity pilot carrier-to-noise ratio for start of identification hysteresis pull-in frequency range of identification PLL (referenced to fdet STEREO = 117.48 Hz and fdet DUAL = 274.12 Hz) note 4 note 5 note 4 lower side STEREO DUAL upper side STEREO DUAL 0.63 0.69 - - 0.63 0.69 Hz Hz -0.63 -0.69 - - -0.63 -0.69 Hz Hz - - - 28 33 - - - 2 dBV dB/Hz dB
1995 Mar 20
10
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
SYMBOL tdet PARAMETER pull-in time of identification PLL (referenced to fdet STEREO = 117.48 Hz and fdet DUAL = 274.12 Hz) identification window frequency width (referenced to fdet STEREO = 117.48 Hz and fdet DUAL = 274.12 Hz) integrator time constant total identification time on total identification time off STEREO; note 7 DUAL; note 7 tident(off) STEREO; note 8 DUAL; note 8 LED (pins 14 and 15) VL(off) VL(on) IL(off) IL(on) output voltage output voltage input current input current LED off LED on LED off LED on - - - - - - - - - - - - 8.8 0.7 1 12 CONDITIONS STEREO DUAL 0 0 MIN. - - - - - - - - - TYP.
TDA9845
MAX. 0.8 0.8 s s
UNIT
fident
STEREO; note 6 DUAL; note 6
2.2 2.3
2.2 2.3
Hz Hz
tintegr tident(on)
0.94 0.35 0.35 0.60 0.60
0.94 2.0 2.0 1.5 1.5
s s s s s
V V A mA
Control input ports C1, C2 and C3 (pins 1, 2 and 20) VCL VCH ICL ICH Notes 1. Vo = 0.5 V RMS value; f = 1 kHz. 2. Without de-emphasis capacitors with respect to nominal gain. 3. In dual mode: A (B)-signal into B (A) channel. In stereo mode: R-signal into left channel; L-signal = 0. 4. Tuner input signal, measured with PCALH reference front end (12EMF, 75 , 2T/20T/white bar, 100% video) and PC/SC1 = 13 dB; PC/SC2 = 20 dB. The pilot band-pass has to be aligned. 5. Bandwidth of the pilot BP-filter B-3 dB = 1.2 kHz. Vi 2 input driven with identification-modulated pilot carrier and white noise. 6. Identification window is defined as twice the pull-in frequency range (lower plus upper side) of identification PLL (steady detection) plus window increase due to integrator (fluctuating detection). 7. The maximum total system identification time ON is equal to tident(on) plus tacqui AGC. 8. The maximum total system identification time OFF is equal to tident(off). LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current 0 2.4 - - 0.8 8.8 -1 1 V V A A
1995 Mar 20
11
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
Table 1 Control input port matrix to select AF inputs and AF outputs INPUT SIGNAL INPUT/OUTPUT MODE ST/DS/M EXT OUTPUT SIGNAL MAIN Vo 1 PIN 12 Vo 2 PIN 11 CONTROL INPUT PORT(1) C3 C2 C1 PIN 20 PIN 2 PIN 1 0 1 0 0 0 0 0 0 0 0 0 1 1 0 0 0 1 1 0 1 1 0 1 1 0 1 0 0 1 0 1 1 0 1 1 0 1 1 0
TDA9845
LED DUAL PIN 14 OFF note 3 OFF OFF OFF OFF OFF OFF ON ON ON note 3 OFF STEREO PIN 15 OFF note 3 OFF OFF OFF ON ON ON OFF OFF OFF note 3 OFF
Vi 1 Vi 2 Vi 3 PIN 8 PIN 9 PIN 10 Mute; note 2 Sound mute Mono - - M - - M M AM Stereo ST S S S Dual DS A A A External; note 4 - - - Notes 1. The combination 111 is not allowed. - - - - - R R R B B B - - - - - - - - - - - - - C C
no signal no signal M M AM L S S A A B C C M M AM R S S B A B C C
2. In mute mode the content of the 117 Hz/274 Hz integrator will be reset. The LEDs are switched OFF. 3. The LED show the identification status. 4. In external mode, in the combination 110 only the LEDs are switched OFF. Table 2 Explanation of Table 1 DESCRIPTION right left ( L + R) -------------------2 dual sound A/B external sound source AM sound (standard L) mono sound dual sound stereo sound
SIGNAL R L S A and B C AM M DS ST
1995 Mar 20
12
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
TDA9845
+2 VoAF (dB) +1 R: -15%; C: -5%
MED647
0
-1
R: +15%; C: +5%
-2 10
10 2
10 3
10 4
foAF (Hz)
10 5
Fig.4
Tolerance scheme of AF frequency response; de-emphasis with CD1, CD2 = 10 nF (5%), Rinternal = 5 k (15%).
1995 Mar 20
13
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
TDA9845
handbook, full pagewidth
C1 control input ports C2 C AGC 10 F
1
20 XTAL
C3 control input port 10 MHz
2
19 CVP 10 F VP
3 10 nF 4 100 nF 5
18
C LP
17
5% C D2 10 nF
50 s de-emphasis
1/2 V P
C DCL
16
TDA9845
stereo transmission 6 47 pF 3.3 nF 2.5 mH 7 30 k AF from 5.5 MHz or from AM demodulator (L) AF from 5.742 MHz 2.2 k Vi 1 2.2 k 8 13 5% C D1 10 nF Vo 1 main from external sound source Vi 3 3 x 2.2 F 10 11
MED648 - 1
15
1 k
VP
14
dual transmission 50 s de-emphasis
Vi 2
9
12
Vo 2
Fig.5 Test circuit of the stereo decoder TDA9845.
handbook, full pagewidth
VB 10 k 100 F
VP
12 18
Vo 1 measurements on outputs
TDA9845
11 7 8 9 10
16
Vo 2
5 V modulated with 200 mV (p-p)
100 F/ 16 V 100 F
MED650 - 1
70 Hz
Fig.6 Test circuit for measurement of ripple rejection.
1995 Mar 20
14
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
INTERNAL CIRCUITRY
TDA9845
handbook, full pagewidth
VP 3 A 1 2 k - VP 3 A 2 2 k + 13 k 5 k
VP 3 A 2 k 20 19 3 pF +5 V
C3 XTAL
C1
18
VP
C2
5 k
3 CAGC
25 k
60 A VP VP VP
TDA9845
CLP
4 25 k 1/2 VP 5 40 A VP VP 60 A 15 LEDST
CDCL
VP 40 A
25 k 14 LEDDU
Vi pil
5 k 6
5 k
5 k VP Vi 1 8
5 k
22.5 k
IB
VP 50 k 1/2 VP IB AF inputs 100 12 Vo 1
Vi 2
9 50 k 1/2 VP IB 200 A VP 100
AF outputs
Vi 3
10 50 k 1/2 VP VP
MED649 - 1
IB
ESD protection diode for pins 3 to 13, 17 and 19
zener diode protection for pins 1, 2, 14, 15, 18 and 20
Fig.7 Internal circuitry.
1995 Mar 20
15
-
+
Cref
7
- - + 16 5 k 13 - + 11 200 A
+
17
C
D2
GND
C
D1
Vo 2
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
TDA9845
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1995 Mar 20
16
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
TDA9845
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1995 Mar 20
17
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
TDA9845
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON 4OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
1995 Mar 20
18
Philips Semiconductors
Preliminary specification
TV and VTR stereo/dual sound processor with digital identification
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA9845
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Mar 20
19
Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)480 6960/480 6009 India: Philips INDIA Ltd, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)7640 000, Fax. (01)7640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD39 (c) Philips Electronics N.V. 1995
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/50/02/pp20 Document order number: Date of release: 1995 Mar 20 9397 750 00107
Philips Semiconductors


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